28. May 2019 | Planegg

Along with booming growth in Artificial Intelligence (AI), the Robotic industry shows a rapid growth trend over the past several years, with advancements in personal assistant, child education, and business service areas.


Main Features:

  • Object Localization
  • Defect Detection & Segmentation
  • Object Classification

Faced with diversified Robotic products, Atlantik introduces Thundercomms’ platform of System on Modules that have high speed computation capability, high reliability, and low-power characteristic.

The platform allows developers to significantly shorten time to market with ready to hardware components, expanded with AI algorithms like:

  • Deep learning algorithms for  general object detection, food and calorie recognition, smart scene detection, and a series of additional AI algorithms.
  • Image processing algorithms: 3A, WDR (wide dynamic range), 360 stitching, noise reduction, image stabilization, and a series of image quality enhancement technologies.
  • Intelligent vision solution for vertical industries such as quality inspections and logistics that use cameras and AI to do visual inspection, improving productivity and quality in scenarios like factory quality assurance and visual inspection in the field.
  • Support ToF(Time-of-Flight) and Structured Light 3D  camera modules
  • Support static and dynamic  (objects are moving on the conveyor belt case)  volume measurement



Key Advantages:

  • Higher Inspection Accuracy (Optimized algorithms for industrial scenarios)
  • Self-learning & Flexible/Generic System (Based on deep learning)
  • Quick Implementation & Application (Less dataset samples required)
  • End-to-End Solution (With HW + SW + Custom System Integration + Service)


Qualcomm® Robotics RB3 Platform

  • SDA845 8x Kryo 385 CPU, up to 2.8 GHz, 64GB UFS 2.1 on-board storage, 4GB LPDDR4
  • 802.11 a/b/g/n/ac 2x2 with DBS, Qualcomm TrueWireless Bluetooth 5.0
  • Linux and Robot Operating System (ROS) , Neural Processing software development kit (SDK) for advanced on-device AI, Qualcomm Computer Vision Suite, Hexagon DSP SDK, and AWS RoboMaker

Thundercomm TurboX™ S605 SBC

  • Qualcomm® RedDragon™ QCS605, 8x Kryo™ 300 CPU,up to 2.5 GHz, eMMC 64GB, LPDDR4x 6GB
  • 802.11a/b/g/n/ac 2×2, Bluetooth 5.0
  • Android 8.1, various SW platforms & dev kits  like vision intelligence, security, smart home, smart display & smart camera