NEW HYPERRAMS FROM WINBOND
17. December 2019 | Planegg
Address new AIoT application
Features:
- Interface: HyperBus
- Density: 32Mb, 64Mb, 128Mb
- Double-Data Rate (DDR) Up to 333 MT/s
- Power supply: 1.7V~1.95V
- Maximum clock rate: 166MHz
- Operating temperature range: -40°C to +85°C
- Power Saving Modes:
- Hybrid Sleep Mode
- Deep Power Down
- 8-bit data bus
- Hardware reset
- Support package: 24 balls TFBGA
- Configurable output drive strength
- Up to 400Mbps 8-bits I/O
- Low PIN count
- Easy control
- PKG type
HyperRAMs communicate via HyperBus interface and are available in 24-port BGAs (automotive grade, 6 mm x 8 mm), 49-port BGAs (4 mm x 4 mm) and bare die (unhoused).
Winbond’s 64Mbit HyperRAM® consumes 90 microW at 1.8V, which is about half of a DRAM of the same capacity, claims the company. The power consumption of HyperRAM® is only 45 microW at 1.8V in hybrid sleep mode – as opposed to the standby mode of an SDRAM. A low power SDRAM has a larger form factor than HyperRAM®.
In addition, HyperRAM® has only 13 signal pins, which can greatly simplify the PCB layout design. It also means that when designing end products, developers can use microcontrollers with more pin-out for other purposes or use microcontrollers with fewer pins for cost-effectiveness.
Simplifying control interface is another feature of HyperRAM®. Based on pSRAM architecture, HyperRAM® is a self-refresh RAM. It can automatically return to standby mode. This means system memory is easier to use, and the development of firmware and drivers is also simplified.
32 Mb HyperRAMs are already in series production and the 64 and 128 Mb HyperRAMs are expected to go into series production in the first quarter of 2020 and will be then available at Atlantik Elektronik.
